ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,424, issued on May 13, was assigned to CYNTEC Co. LTD. (Hsinchu, Taiwan).

"Stacked electronic structure" was invented by Wenyu Lin (Taipei, Taiwan), TsungHao Lu (Hsinchu, Taiwan) and Hao Chun Chang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A stacked electronic structure, including a substrate, wherein electronic devices are disposed on the substrate, and a molding body encapsulates the electronic devices, wherein a first thermal conductive layer is disposed on a first electronic device, and a second thermal conductive layer is disposed on a second electronic device, wherein a magnetic device comprising a magnetic body is dispos...