US Patent Issued to CSP Technologies on Dec. 23 for "Blister packages containing active material and methods of making and using same" (Alabama Inventor)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,503,290, issued on Dec. 23, was assigned to CSP Technologies Inc. (Auburn, Ala.).

"Blister packages containing active material and methods of making and using same" was invented by James Hollinger (Auburn, Ala.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A blister pack including a backing and an active layer coextensively attached to the backing. A cover is attached to the layer. The cover forms one or more spaced-apart blisters. Each blister and the layer combine to form a cavity configured to enclose at least one product. The active layer within each blister is embossed to form one or more points of weakness configured to facilitate rupture of the ...