US Patent Issued to CRAIF on June 24 for "Method for patterning a substrate, a method for forming a microstructure on a substrate, and a method for fabricating a fluidic device" (Japanese Inventor)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,338,523, issued on June 24, was assigned to CRAIF INC. (Tokyo).

"Method for patterning a substrate, a method for forming a microstructure on a substrate, and a method for fabricating a fluidic device" was invented by Keishu Tsuda (Nagoya, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to an embodiment of the present disclosure, a method for patterning a substrate is provided. In some embodiments, the method includes patterning a hydrophobic film formed on a surface of a substrate, applying a target material, and oxidizing at least the surface of the applied target material. In some embodiments, the method further includes removing the hy...