US Patent Issued to CPC, Taiwan on April 29 for "Loss-dissipation flexible copper clad laminate, manufacturing method thereof, and electronic device" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,286,511, issued on April 29, was assigned to CPC Corporation, Taiwan (Kaohsiung, Taiwan).

"Loss-dissipation flexible copper clad laminate, manufacturing method thereof, and electronic device" was invented by Ching-Hsuan Lin (Taichung, Taiwan) and Wan-Ling Hsiao (Changhua County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a low-dissipation flexible copper clad laminate, which includes a copper foil and a polyimide film. The polyimide film is attached to the copper foil. The polyimide film includes a polyimide, and the polyimide has a structure represented by formula (I). Formula (I) is defined as in the specifica...