US Patent Issued to COWLES SEMI on Feb. 18 for "Method and apparatus for multiple axis direct transfers of semiconductor devices" (Washington, Idaho Inventors)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,519, issued on Feb. 18, was assigned to COWLES SEMI LLC (Spokane, Wash.).

"Method and apparatus for multiple axis direct transfers of semiconductor devices" was invented by Sean Kupcow (Greenacres, Wash.), Nicholas Steven Busch (Spokane, Wash.) and Justin Wendt (Post Falls, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for a direct transfer of a semiconductor device die from a wafer tape to a substrate. A first frame holds the wafer tape and a second frame secures the substrate. The second frame holds the substrate such that a transfer surface is disposed facing the semiconductor device die on a first side of the wafer tape. A ne...