ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,690, issued on Aug. 19, was assigned to CORNING RESEARCH & DEVELOPMENT Corp. (Corning, N.Y.).
"Systems and methods of nano-particle bonding for electronics cooling" was invented by James Scott Sutherland (Painted Post, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Devices and methods for providing cooling to electronics equipment is provided herein. A cooling manifold includes a first substrate having a first hole. A layer of nano-particles is disposed between the first substrate and an electronics surface associated with the electronics equipment. The layer of nano-particles defines a seal between the first substrate and the electronics surfa...