ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,434,992, issued on Oct. 7, was assigned to CORNING Inc. (Corning, N.Y.).
"Heat chamfering apparatus and method" was invented by Euisoo Kim (Seongnam-si, South Korea), Bokyung Kong (Hwasung, South Korea), JooYoung Lee (Anyang-si, South Korea) and Kwangje Woo (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat chamfering apparatus includes a heated body configured to peel an edge of a glass panel by applying thermal shock to the glass panel while being in contact with the edge of the glass panel and a heater heating the heated body. The heated body includes a heated region and a contact region in a longitudinal direction thereof, t...