US Patent Issued to CORNING on May 20 for "Sacrificial layers to enable laser cutting of textured substrates" (New York Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,304,005, issued on May 20, was assigned to CORNING Inc. (Corning, N.Y.).

"Sacrificial layers to enable laser cutting of textured substrates" was invented by Garrett Andrew Piech (Corning, N.Y.) and Sergio Tsuda (Horseheads, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of separating a transparent workpiece comprises depositing a sacrificial layer onto a textured surface of the transparent workpiece, the sacrificial layer comprising a refractive index that is less than or equal to a refractive index of the transparent workpiece and greater than or equal to a refractive index of air. A defect-forming laser beam is generated via an optical a...