US Patent Issued to Corning on June 10 for "Integrated circuit packages having electrical and optical connectivity and methods of making the same" (South Korean, American Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,326,604, issued on June 10, was assigned to Corning Inc. (Corning, N.Y.).

"Integrated circuit packages having electrical and optical connectivity and methods of making the same" was invented by Lars Martin Otfried Brusberg (Corning, N.Y.), Jin Su Kim (Seoul, South Korea) and Aramais Robert Zakharian (Painted Post, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Integrated circuit packages having electrical and optical connectivity and methods of making the same are disclosed herein. According to one embodiment, an integrated circuit package includes a glass substrate, an optical channel, and redistribution layers. The integrated circuit package furt...