US Patent Issued to CORNING on July 8 for "Glass carrier for die-up fan-out packaging and methods for making the same" (South Korean, American Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,996, issued on July 8, was assigned to CORNING Inc. (Corning, N.Y.).

"Glass carrier for die-up fan-out packaging and methods for making the same" was invented by Jin Su Kim (Seoul, South Korea) and Yu Xiao (Pittsford, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer- or panel-level encapsulated package comprises a glass substrate comprising a glass cladding layer (105) fused to a glass core layer (110), the glass substrate comprising a cavity (425), wherein the glass cladding layer has a higher etch rate in an etchant than the glass core layer. The wafer- or panel-level encapsulated package further comprises a microelectronic component (70...