US Patent Issued to CORNING on Feb. 10 for "Glass substrate heat chamfering method and apparatus" (South Korean, American Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,545,616, issued on Feb. 10, was assigned to CORNING Inc. (Corning, N.Y.).

"Glass substrate heat chamfering method and apparatus" was invented by Dipakbin Qasem Chowdhury (Corning, N.Y.), Euiho Kim (Asan-si, South Korea), Euisoo Kim (Seongnam-si, South Korea) and Seong-ryong Ryoo (Asan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a glass substrate heat chamfering method. An edge of a glass substrate (100) is chamfered by applying thermal shock to the edge of the glass substrate (100), thereby peeling a strip (100a) off from the edge of the glass substrate (100). The strip is cut at a predetermined point thereon before being ...