US Patent Issued to Corning on Dec. 23 for "Substrate thinning process using temporary bond with low thickness variation" (American, South Korean, Taiwanese, German Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,507,593, issued on Dec. 23, was assigned to Corning Inc. (Corning, N.Y.).

"Substrate thinning process using temporary bond with low thickness variation" was invented by Indrani Bhattacharyya (Newark, Calif.), Julia Anne Dorothee Brueckner (Nieder-Olm, Germany), Ya-Huei Chang (Zhudong Township, Taiwan), Bokyung Kong (Hwaseong-si, South Korea), Prantik Mazumder (Ithaca, N.Y.), Jun Ro Yoon (Painted Post, N.Y.) and Jian-Zhi Jay Zhang (Ithaca, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An article including a support unit, the support unit including a support substrate and a bonding layer such that the bonding layer is bonded to a surface of the supp...