US Patent Issued to Corning on Aug. 12 for "Substrate cutting and separating systems and methods" (German, American Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,383,985, issued on Aug. 12, was assigned to Corning Inc. (Corning, N.Y.).

"Substrate cutting and separating systems and methods" was invented by Andreas Simon Gaab (Grobenzell, Germany), Richard Anthony Gaona (Novato, Calif.), Nicolai Martin Haenel (Bayern, Germany), Dale Humphrey (Santa Rosa, Calif.), Ralf Joachim Terbrueggen (Bavaria, Germany) and John Eric Tyler (Napa, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a plurality of defects within a substrate with a laser beam focal line using a laser beam, each defect of the plurality of defects being a damage track within the substrate with a diameter of about 10 microns or ...