ALEXANDRIA, Va., June 10 -- United States Patent no. 12,292,674, issued on May 6, was assigned to Coretronic Corp. (Hsin-Chu, Taiwan).
"Heat dissipation module and projection device" was invented by Pei-Rong Wu (Hsin-Chu, Taiwan) and Shi-Wen Lin (Hsin-Chu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation module, configured for heat dissipation of at least one first heat source and at least one second heat source, and including a first heat sink, a second heat sink, a first pipe, and a second pipe, is provided. The first heat sink and the first heat source are connected to each other through the first pipe to form a first loop, so that a liquid medium flows through the first heat sink ...