ALEXANDRIA, Va., June 25 -- United States Patent no. 12,339,572, issued on June 24, was assigned to Coretronic Corp. (Hsin-Chu, Taiwan).
"Heat dissipating module and projection device" was invented by Shi-Wen Lin (Hsin-Chu, Taiwan), Wei-Chi Liu (Hsin-Chu, Taiwan) and Tsung-Ching Lin (Hsin-Chu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipating module includes a casing including a bottom plate and a water inlet; a cover plate disposed on one side of the casing opposite to the bottom plate; a pressurizing device moving back and forth in the casing and having a maximum stroke; a water pump disposed between the bottom plate and the pressurizing device, where liquid fills a space between the...