ALEXANDRIA, Va., June 19 -- United States Patent no. 12,332,556, issued on June 17, was assigned to Coretronic Corp. (Hsin-Chu, Taiwan).
"Heat dissipation module and projection device" was invented by Te-Ying Tsai (Hsin-Chu, Taiwan) and Jia-Hong Dai (Hsin-Chu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation module is for a wheel module with a motor. The heat dissipation module includes a supporting member and a fan. The supporting member has a supporting portion, a fixing portion and connecting portions. The fixing portion is located in a ventilation hole of the supporting portion and connected to the supporting portion by the connecting portions. The fixing portion has opposite firs...