ALEXANDRIA, Va., July 23 -- United States Patent no. 12,369,430, issued on July 22, was assigned to Coretronic Corp. (Hsin-Chu, Taiwan).
"Bonding method for electronic element" was invented by Yi-Hsing Peng (Hsin-Chu, Taiwan) and Ching-Tai Tseng (Hsin-Chu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding method for an electronic element includes attaching a solder film to a display substrate and covering multiple bonding pads, performing a heat treatment step so that a solder layer on the multiple bonding pads is transformed into multiple solder bumps, providing at least one electronic element and covering the solder bumps, and heating the solder bumps to electrically bond the at least one ele...