US Patent Issued to CoolIT Systems on July 15 for "Liquid-cooling devices, and systems, to cool multi-chip modules" (Canadian Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,363,857, issued on July 15, was assigned to CoolIT Systems Inc. (Calgary, Canada).

"Liquid-cooling devices, and systems, to cool multi-chip modules" was invented by Bradley Zakaib (Calgary, Canada), Seyed Kamaleddin Mostafavi Yazdi (Calgary, Canada), Jarod Domingo (Calgary, Canada) and Yixuan Gao (Calgary, Canada).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat exchanger for a liquid cooling system has an enclosure defining an internal chamber and a wall defining an external major surface of the enclosure. The enclosure extends from a first open end to an opposed second open end and an inlet passage extends from the first open end to the internal c...