US Patent Issued to CONTEMPORARY AMPEREX TECHNOLOGY (HONG KONG) on June 10 for "Electrolytic copper foil and preparation method therefor, negative electrode plate, secondary battery, battery module, battery pack and power consuming device" (Chinese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,862, issued on June 10, was assigned to CONTEMPORARY AMPEREX TECHNOLOGY (HONG KONG) Ltd. (Hong Kong).

"Electrolytic copper foil and preparation method therefor, negative electrode plate, secondary battery, battery module, battery pack and power consuming device" was invented by Yukun Wu (Ningde, China) and Xiaoming Ge (Ningde, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for preparing an electrolytic copper foil includes placing an anode and a cathode to be plated in a twin crystal growth agent containing electroplating solution in an electroplating tank, and, under conditions that the electroplating solution is provided with random...