US Patent Issued to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES on Nov. 4 for "Method for bonding chips to a substrate by direct bonding" (French Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,174, issued on Nov. 4, was assigned to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (Paris).

"Method for bonding chips to a substrate by direct bonding" was invented by Frank Fournel (Grenoble, France), Loic Sanchez (Grenoble, France) and Brigitte Montmayeul (Grenoble, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "A process for bonding chips to a substrate by direct bonding includes providing a support with which the chips are in contact, the chips in contact with the support being separate from one another. This bonding process also includes forming a liquid film on one face of the substrate, bringing the chips into contact...