ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,658, issued on Nov. 18, was assigned to Commissariat a l'Energie Atomique et aux Energies Alternatives (Paris).
"Electronic circuit manufacturing method for self-assembly to another electronic circuit" was invented by Alice Bond (Grenoble, France) and Emilie Bourjot (Grenoble, France).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present description relates to a method of manufacturing an electronic circuit (30) comprising: a support (32), an assembly site (31) having a first surface protruding from said support intended to be assembled to an assembly site of another electronic circuit by a self-assembly method; and a peripheral area (39) around...