ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,508, issued on Feb. 18, was assigned to Commissariat a l'Energie Atomique et aux Energies Alternatives (Paris).
"Substrate structuring method" was invented by Pierre Montmeat (Grenoble, France) and Franck Fournel (Grenoble, France).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method comprising the following steps: a) Bonding a handle substrate including raised elements to a substrate of interest including a support substrate covered with a thin film including a material sensitive to an etchant, whereby the thin film includes first areas not covered with the raised elements and second areas covered with said elements, b) Placing into contact the o...