US Patent Issued to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, Soitec on Sept. 16 for "Process for hydrophilically bonding substrates" (French Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,942, issued on Sept. 16, was assigned to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (Paris) and Soitec (Bernin, France).

"Process for hydrophilically bonding substrates" was invented by Vincent Larrey (Grenoble, France), Francois Rieutord (Grenoble, France), Jean-Michel Hartmann (Grenoble, France), Frank Fournel (Grenoble, France), Didier Landru (Le Champ-pres-Froges, France), Oleg Kononchuk (Theys, France) and Ludovic Ecarnot (Grenoble, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "A process for hydrophilic bonding first and second substrates, comprising: -bringing the first and second substrates into contact to form a ...