ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,212,087, issued on Jan. 28, was assigned to Cobham Advanced Electronic Solutions Inc. (Lansdale, Pa.).
"Topside air cooling of electronic packages" was invented by Chul Hong Park (Blue Bell, Pa.).
According to the abstract* released by the U.S. Patent & Trademark Office: "The semiconductor chip includes a semiconductor substrate having a surface, a circuit formed on the surface, and a plurality of pillars coupled to the surface adjacent to the circuit. The plurality of pillars is thermally conductive and is thermally coupled to the circuit so as to dissipate heat generated by the circuit. The semiconductor substrate, circuit, and plurality of pillars are integral parts of the integra...