US Patent Issued to CO-TECH DEVELOPMENT on Feb. 17 for "Micro-roughened electrodeposited copper foil and copper clad laminate" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,213, issued on Feb. 17, was assigned to CO-TECH DEVELOPMENT CORP. (Taipei, Taiwan).

"Micro-roughened electrodeposited copper foil and copper clad laminate" was invented by Yun-Hsing Sung (Taoyuan, Taiwan), Shih-Shen Lee (New Taipei, Taiwan), Hung-Wei Hsu (Yun Lin County, Taiwan) and Chun-Yu Kao (Yunlin County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a micro-roughened electrodeposited copper foil, which comprises a micro-rough surface and multiple copper nodules. The micro-roughened electrodeposited copper foil has an Sdr of 0.01 to 0.08. With the surface characteristics, the electron path distance can be shortened, such tha...