US Patent Issued to CMC MATERIALS on Nov. 4 for "Chemical-mechanical polishing subpad having porogens with polymeric shells" (Oregon, Illinois Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,459,076, issued on Nov. 4, was assigned to CMC MATERIALS LLC (Billerica, Mass.).

"Chemical-mechanical polishing subpad having porogens with polymeric shells" was invented by Dustin Miller (Beaverton, Ore.), Paul Andre Lefevre (Portland, Ore.), Aaron Peterson (Portland, Ore.) and Chen-Chih Tsai (Naperville, Ill.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A subpad for a chemical-mechanical polishing pad, the subpad having porogens with polymeric shells. Methods of fabricating the subpad and polishing pads with a polishing surface layer bonded to the subpad layer are also described."

The patent was filed on Dec. 21, 2021, under Application No. 17/557,4...