ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,472,602, issued on Nov. 18, was assigned to CMC MATERIALS LLC (Aurora, Ill.).
"Textured CMP pad comprising polymer particles" was invented by Rui Ma (Aurora, Ill.), Kaiting Li (Portland, Ore.), Jessica Tabert (Aurora, Ill.), Sangcheol Kim (Chicago) and Satish Rai (Aurora, Ill.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A chemical mechanical polishing pad comprising a polishing portion, the polishing portion comprising: a polymeric body; a plurality of polymer particles embedded within the body of the polymeric body, wherein at least a portion of the plurality of polymer particles is at least partially exposed at a surface of the polymeric body; and ...