ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,466,979, issued on Nov. 11, was assigned to CMC Materials LLC (Aurora, Ill.).
"CMP composition including anionic and cationic inhibitors" was invented by Hsin-Yen Wu (Kaohsiung, Taiwan), Jin-Hao Jhang (Taichung, Taiwan) and Cheng-Yuan Ko (Kaohsiung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A chemical mechanical polishing composition for polishing tungsten or molybdenum comprises, consists essentially of, or consists of a water based liquid carrier, abrasive particles dispersed in the liquid carrier, an amino acid selected from the group consisting of arginine, histidine, cysteine, lysine, and mixtures thereof, an anionic polymer or an anion...