US Patent Issued to CLEVO on March 25 for "Heat dissipation structure" (Taiwanese Inventor)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,262,507, issued on March 25, was assigned to CLEVO Co. (New Taipei, Taiwan).

"Heat dissipation structure" was invented by Chi-Hsueh Yang (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation structure is provided. The heat dissipation structure includes a heat dissipation unit and a fixation unit. The fixation unit has a bottom and a wall that jointly define a hollow area. The fixation unit is surroundingly arranged on a periphery of a heating source. The hollow area has a first non-masking area, a second non-masking area, and a masking area. The masking area corresponds to at least one part of the heat dissipation unit, and...