ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,526,964, issued on Jan. 13, was assigned to CLEVO CO (New Taipei, Taiwan).
"Heat dissipation module" was invented by Chi-Hsueh Yang (Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation module is provided. The heat dissipation module includes a heat dissipating sheet and a heat conduction member. The heat dissipating sheet has a first surface and a second surface. The heat conduction member is disposed on the first surface of the heat dissipating sheet, and the second surface of the heat dissipating sheet is configured to be arranged adjacent to a periphery of a heating source. At least a part of a surface of the heat conduct...