ALEXANDRIA, Va., March 12 -- United States Patent no. 12,246,880, issued on March 11, was assigned to CJ CHEILJEDANG Corp. (Seoul, South Korea).

"Apparatus and method for forming container and container" was invented by Byung Kook Lee (Seoul, South Korea), Kwang Soo Park (Gwacheon-si, South Korea), Hui Jae Song (Seoul, South Korea) and Gyu Hwan Cha (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a receptacle molding apparatus, a receptacle and a receptacle molding method. The receptacle molding apparatus, which is for molding a receptacle by means of heat molding, comprises: a first mold portion comprising a body molding part, which is for molding a body of a...