ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,473,656, issued on Nov. 18, was assigned to City University of Hong Kong (Hong Kong, Hong Kong).
"Gold-copper alloy nanostructure and method for synthesizing the same" was invented by Hua Zhang (Hong Kong, Hong Kong), Xichen Zhou (Hong Kong, Hong Kong) and An Zhang (Hong Kong, Hong Kong).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a gold-copper alloy nanostructure which can be used as a catalyst for electrochemical CO2 reduction reaction and a method for synthesizing the same. The provided gold-copper alloy nanostructure has a heterophase composed of a hexagonal close-packed phase and a face-centered cubic phase. This go...