US Patent Issued to CISCO TECHNOLOGY on Sept. 23 for "Combined liquid and air cooling system for fail-safe operation of high power density ASIC devices" (California Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,426,212, issued on Sept. 23, was assigned to CISCO TECHNOLOGY INC. (San Jose, Calif.).

"Combined liquid and air cooling system for fail-safe operation of high power density ASIC devices" was invented by M. Baris Dogruoz (Santa Clara, Calif.) and Joel Goergen (Soulsbyville, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A combined liquid and air cooling system is provided over a printed circuit board (PCB) of an electronic device, where the PCB includes an integrated circuit package including an application specific integrated circuit (ASIC) die and a plurality of high bandwidth memory (HBM) modules located proximate the ASIC die, and the combine...