ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,461,304, issued on Nov. 4, was assigned to Cisco Technology Inc. (San Jose, Calif.).
"Optical packaging features for mechanical stability and optical fiber coupling" was invented by Aparna R. Prasad (San Jose, Calif.), Norbert Schlepple (Macungie, Pa.), Vipulkumar K. Patel (Breinigsville, Pa.) and Arturo Pachon Munoz (San Jose, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An optical package with increased mechanical stability of co-packaged optic components is described. The optical package includes an electronic mold compound (EMC) layer with copper pillars formed through the EMC layer. The optical package also includes a silicon interposer lay...