US Patent Issued to CISCO TECHNOLOGY on April 29 for "Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane" (California Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,289,831, issued on April 29, was assigned to CISCO TECHNOLOGY INC. (San Jose, Calif.).

"Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane" was invented by Joel Goergen (Soulsbyville, Calif.), Jessica Kiefer (San Jose, Calif.), Alpesh Umakant Bhobe (Sunnyvale, Calif.), Kameron Rose Hurst (Sonora, Calif.), D. Brice Achkir (Livermore, Calif.), Amendra Koul (San Francisco), Scott Hinaga (Palo Alto, Calif.) and David Nozadze (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper ...