ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,419,010, issued on Sept. 16, was assigned to Ciena Corp. (Hanover, Md.).
"Dual flow low profile coolant distribution manifold" was invented by Simon J. Shearman (Carleton Place, Canada), Behzad Mohajer (Vancouver, Canada) and Peter Ajersch (Ottawa).
According to the abstract* released by the U.S. Patent & Trademark Office: "A coolant distribution manifold assembly for use in a module or circuit pack of an optical networking system, including: a body defining a main inlet port at one end, a main outlet port at another end, and a plurality of cooling plate inlet ports and cooling plate outlet ports disposed between the main inlet port and the main outlet port; where the body further d...