US Patent Issued to Ciena on Jan. 13 for "Outdoor networking equipment enclosure utilizing internal open frame power supply for optimum thermal management and cable minimization" (Indian Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,526,947, issued on Jan. 13, was assigned to Ciena Corp. (Hanover, Md.).

"Outdoor networking equipment enclosure utilizing internal open frame power supply for optimum thermal management and cable minimization" was invented by Chander Prakash Gupta (Gurugram, India), Sachin Singla (Gurugram, India), Suyash Agrawal (Gurugram, India), Ranjeet Chaurasiya (Gurugram, India) and Karan Goel (Gurugram, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "A networking equipment enclosure assembly, including: a base chassis; a lid coupled to the base chassis; a printed circuit board disposed within the base chassis; and a power supply unit disposed between the pri...