US Patent Issued to Ciena on Feb. 25 for "Hardened optical platform including high-power electro-optics and heat dissipating circuitry and associated thermal solution" (Indian Inventors)

ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 12,238,851, issued on Feb. 25, was assigned to Ciena Corp. (Hanover, Md.).

"Hardened optical platform including high-power electro-optics and heat dissipating circuitry and associated thermal solution" was invented by Chander Prakash Gupta (Gurugram, India), Sachin Singla (Gurugram, India), Ranjeet Chaurasiya (Gurugram, India), Rampratap Mahawar (Gurugram, India) and Shubham Kumar (Gurugram, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a thermal solution using a heat exchanger mounted inside an outdoor telecom unit. More specifically, a hardened optical platform includes a base chassis and a lid configured to seal ...