ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,954, issued on April 29, was assigned to Ciena Corp. (Hanover, Md.).
"Secondary side heatsink techniques for optical and electrical modules" was invented by Mitchell O'Leary (Ottawa), Victor Aldea (Ottawa), Kamran Rahmani (Kanata, Canada), Trevor Meunier (Kemptville, Canada), Peter Ajersch (Ottawa), Terence Graham (Manotick, Canada) and Marc Leclair (Gatineau, Canada).
According to the abstract* released by the U.S. Patent & Trademark Office: "A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical dire...