US Patent Issued to CHUGAI SEIYAKU on June 17 for "Deprotection method and resin removal method in solid-phase reaction for peptide compound or amide compound, and method for producing peptide compound" (Japanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,331,072, issued on June 17, was assigned to CHUGAI SEIYAKU K.K. (Tokyo).

"Deprotection method and resin removal method in solid-phase reaction for peptide compound or amide compound, and method for producing peptide compound" was invented by Kotaro Iwasaki (Tokyo) and Shio Komiya (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present inventors found that peptide compounds/amide compounds in which the protecting groups of interest are removed and/or which are removed from resins for solid-phase synthesis can be produced without main chain damage by contacting starting peptide compounds/amide compounds with silylating agents."

The patent was f...