ALEXANDRIA, Va., July 3 -- United States Patent no. 12,345,741, issued on July 1, was assigned to CHROMA ATE INC. (Taoyuan, Taiwan).
"Wafer inspection method and inspection apparatus" was invented by Tsun-I Wang (Taoyuan, Taiwan), I-Shih Tseng (Taoyuan, Taiwan), Min-Hung Chang (Taoyuan, Taiwan) and Tzu-Tu Chao (Taoyuan, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer inspection method and inspection apparatus that perform a voltage inspection of a die on a wafer by a probe module. The probe module includes a processing module, a first probe coupled to a first electrode point of the die, and a second probe coupled to a second electrode point of the die. The first probe is coupled to the processi...