US Patent Issued to Chongqing University on Oct. 7 for "Method for testing and evaluating short-circuit withstand capability of press-pack power component" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,436,204, issued on Oct. 7, was assigned to Chongqing University (Chongqing, China).

"Method for testing and evaluating short-circuit withstand capability of press-pack power component" was invented by Hui Li (Chongqing, China), Renkuan Liu (Chongqing, China), Ran Yao (Chongqing, China), Wei Lai (Chongqing, China), Zeyu Duan (Chongqing, China), Zheyan Zhu (Chongqing, China), Bailing Zhou (Chongqing, China), Siyu Chen (Chongqing, China), Jinyuan Li (Chongqing, China) and Zhongyuan Chen (Chongqing, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a method for testing and evaluating a short-circuit withstand capability of a press-pack power ...