US Patent Issued to CHIPMORE TECHNOLOGY on June 24 for "Chip redistribution structure and preparation method thereof" (Chinese Inventor)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,064, issued on June 24, was assigned to CHIPMORE TECHNOLOGY CORPORATION LIMITED (Suzhou, China).

"Chip redistribution structure and preparation method thereof" was invented by Guanmeng Xu (Suzhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a chip redistribution structure and a preparation method thereof. The chip redistribution structure includes a chip body, and a first distribution layer and a second distribution layer which are connected to the chip body. A first pin and a second pin are disposed on the surface of the chip body. The chip redistribution structure further includes a dielectric layer disposed...