ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,756, issued on April 29, was assigned to Chipletz Inc. (Spicewood, Texas).
"Semiconductor package with integrated capacitors" was invented by Michael Su (Austin, Texas), Michael Alfano (Austin, Texas) and Siddharth Ravichandran (Austin, Texas).
According to the abstract* released by the U.S. Patent & Trademark Office: "In one aspect, a capacitor or network of capacitors is/are provided for vertical power delivery in a package where the capacitor(s) is/are embedded in or forms the entirety of the package substrate core. In a second aspect, a plurality of thin-film capacitor structures are provided for implementing vertical power delivery in a package. In a third aspect a method is ...