ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,825, issued on Sept. 9, was assigned to CHIPBOND TECHNOLOGY Corp. (Hsinchu, Taiwan).
"Semiconductor package" was invented by Yu-Chen Ma (Kaohsiung, Taiwan), Pei-Wen Wang (Taichung, Taiwan), Hsin-Hao Huang (Kaohsiung, Taiwan) and Gwo-Shyan Sheu (Kaohsiung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "In a semiconductor package, flow guiding strips are provided on a guiding area of a flexible substrate to separate a chip and the flexible substrate such that a filling material flowing between the chip and the flexible substrate can squeeze out the air between the chip and the flexible substrate to improve the reliability of the semiconductor ...