US Patent Issued to CHIPBOND TECHNOLOGY on Sept. 30 for "Flip-chip bonding structure and circuit board thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,849, issued on Sept. 30, was assigned to CHIPBOND TECHNOLOGY Corp. (Hsinchu, Taiwan).

"Flip-chip bonding structure and circuit board thereof" was invented by Chun-Te Lee (Hsinchu County, Taiwan), Chih-Ming Peng (Taichung, Taiwan), Pi-Yu Peng (Hsinchu County, Taiwan) and Hui-Yu Huang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A flip-chip bonding structure includes a chip and a circuit board, the chip is bonded to the circuit board by bumps. The circuit board includes a light-transmissive substrate, a first circuit group, a second circuit group, a boundary circuit and an identifying member. The boundary circuit is located between...