US Patent Issued to CHIPBOND TECHNOLOGY on Sept. 23 for "Semiconductor structure and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,551, issued on Sept. 23, was assigned to CHIPBOND TECHNOLOGY Corp. (Hsinchu, Taiwan).

"Semiconductor structure and method of manufacturing the same" was invented by Chin-Tang Hsieh (Kaohsiung, Taiwan), You-Ming Hsu (Kaohsiung, Taiwan), Chun-Ting Kuo (Kaohsiung, Taiwan), Lung-Hua Ho (Hsinchu, Taiwan) and Chih-Ming Kuo (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a substrate, a dielectric layer, a connection layer and wire layers. The dielectric layer is disposed on a surface of the substrate and includes vias showing the surface. The connection layer is disposed on the dielectric layer, a ...