ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,673, issued on Oct. 28, was assigned to CHIPBOND TECHNOLOGY Corp. (Hsinchu, Taiwan).
"Flip chip package and substrate thereof" was invented by Chun-Te Lee (Hsinchu County, Taiwan), Chih-Ming Peng (Taichung, Taiwan), Pi-Yu Peng (Hsinchu County, Taiwan), Hui-Yu Huang (Hsinchu, Taiwan) and Yin-Chen Lin (Miaoli County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "In a flip chip package, lines, an identification line and a dummy line are provided on a first surface of a light-transmissive carrier, and a supportive layer is disposed on a second surface of the light-transmissive carrier. Bumps and an identification bump of a chip are bonded to the...