US Patent Issued to CHIPBOND TECHNOLOGY on Nov. 4 for "Semiconductor package having flow-guiding grooves and circuit board thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,464,639, issued on Nov. 4, was assigned to CHIPBOND TECHNOLOGY Corp. (Hsinchu, Taiwan).

"Semiconductor package having flow-guiding grooves and circuit board thereof" was invented by Wei-Teng Lin (Hsinchu County, Taiwan), Hui-Yu Huang (Hsinchu, Taiwan), Ching-Chi Chan (Taichung, Taiwan) and Shih-Chieh Chang (Chiayi County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a chip, a circuit board and a filling material. The circuit board includes a substrate, a patterned metal layer and a protective layer. A circuit area, a chip-mounting area and a flow-guiding area are defined on a surface of the substrate. The chip is...