US Patent Issued to CHIPBOND TECHNOLOGY on May 27 for "Electronic package and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,462, issued on May 27, was assigned to CHIPBOND TECHNOLOGY Corp. (Hsinchu, Taiwan).

"Electronic package and method of manufacturing the same" was invented by Chen-Yu Wang (Hsinchu, Taiwan), Pai-Sheng Cheng (Hsinchu, Taiwan) and Huan-Kuen Chen (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a method of manufacturing an electronic package, first grooves are formed on a circuit structure and a second groove is formed in each of the first grooves to allow the circuit structure to become circuit layers. Owing to the second groove is narrower than the first groove, each of the circuit layers has an encircled surface and a notch located...